论作为ＴＥ分析ＩＣ的初步报的基本格式

:lol:

本来ＩＣ分析起来是很复杂的，但是我发现很多电子厂的ＴＥ真的好拉级，即使没有专用的测试设备分析也不至于分析报告就几句话完了，平常人根本一点也看不懂！

小弟初来咋到，听大家多多指点，作为一个ＳＱＡ对ＴＥ的分析报告只要做到以下几点我想　可能会更懂一些吧！
IC FA primary report format

[] Issue Background and description.[/][]Condition[/][]Compare OK and NG test read data[/][]Swap test[/]

Attachment (lead/ball less than 48 IC: LPCC BGA QFP)
a. According to IC diagram find GND location, use multimeter to respectively test OK and NG material.
b. contrast data

[]Summary[/][]Issue Background and description.[/]

State lot code/date code/defect rate( including input total how
many find defects? dosage big or small per day? if happen
before this time.

[]Condition[/] No standard equipment to identify, so only pass defective phenomenon to judge defect.(2) a: Inspect appearance and give five defects mark number. Carefully inspect appearance under 10x magnifier then mark number on inverse. b: do x-ray observe their wire if sweep or open c: check all interrelated ESD, including operation tact and static desk and equipment in production line. Record inspect result and test data which including machine/equipment/operation platform contrast to our spec.[list=1][]Compare OK and NG test read data [/]

a: respectively get data from test program.
b: find OK and NG variation
c: conclusion

[]Swap test （Use illustration mark fail item）[/]

a: result A
　　　b: Result B.
　　　c. Contrast A and B result
　　　c.1.Different board test result is same, show that the board can’t influence IC .

c.2.Different board test result is different, show that the different board can influence IC,
The issue may be board Matching issue.

[] summary[/]

Acquire conclusion form 2./3./4.