PCBA IC應力測試方法的問題
PCBA IC應力測試方法的問題
因為在制程過和中板子會受到擠壓,
如何在實驗室用壓力源來模擬制程中壓力,對板子施加壓力
用應力測試儀來測試應力,並測試板子變形度.
請問各位有無見過此種測試治具?
采用哪些儀器來實現?
一般測試值為多大?
如何define測試方法??
e-mail:wan_jiang@arcadyan.com.cn
因為在制程過和中板子會受到擠壓,
如何在實驗室用壓力源來模擬制程中壓力,對板子施加壓力
用應力測試儀來測試應力,並測試板子變形度.
請問各位有無見過此種測試治具?
采用哪些儀器來實現?
一般測試值為多大?
如何define測試方法??
e-mail:wan_jiang@arcadyan.com.cn
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samnet1 (威望:0) (香港 九龙) -
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IC Test Mehtod ( both Gull Wiing & BGA ):
For Gull-Wing Lead
==> EIA/JESD22-B105-B Lead Integrity
1.1 Test Condition A - Tension
1.2 Test Condition B - Bending Stress
1.3 Test Condition C - Lead Fatigue
1.4 Test Condition D - Lead Torque
1.5 Test Condition E - Stud Torque
XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXx
For BGA :
JESD22-B115 Solder Ball Pull
=>ball extrusion:
=>clamping fixture: A fixture that holds the test sample rigidly during solder ball pull testing (see Figure 2).
=>elapsed time after reflow:
=>failure mode: The type or location of failure observed after the solder ball is pulled.
JESD22-B117A Solder Ball Shear
jaw clamping pressure: The applied pressure exerted upon the solder ball by the pull tool.