HP產品無鉛零件使用指導書

HP產品無鉛零件使用指導書
Revision History
First release 6/30/03
Overview of the transition to lead(Pb)-free electronics
無鉛電子業轉換展望
Impending legislation in Europe is forcing a transition in the electronics industry away
from the use of lead (Pb) in electronic products. HP is aware that many suppliers will be
transitioning to lead-free products before the legislation becomes effective in July 2006.
Your HP procurement representative(s) must be notified of any transition to Pb-free
products in the form of company roadmaps, engineering change notifications (ECNs)
and/or product change notifications (PCNs). The following procurement guidelines are
intended to guide the Pb-free transition plans of HP’s suppliers and the introduction of
Pb-free components and materials into HP products.
歐洲未來立法將要求電子業轉換，取消電子產品中鉛的使用。HP意識到在2006年7月立法生效之前其供應商須轉換成生產無鉛產品。通過公司路標， 工程變更(ECNs) 或產品變更通知(PCNs)等方式, 貴司所聯系之HP相應代理人須了解無鉛產品轉換. 如下使用指導書意在指導HP供應商制定無鉛轉換計劃並將無鉛零件及材料用於HP產品中。
HP expects that suppliers, who are transitioning to Pb-free solutions to meet the
impending European legislation, will choose Pb-free alternatives that are approved by
HP. Please follow “HP’s position on tin-based plating for Pb-free components” in
Appendix A for recommended plating solutions. These procurement guidelines provide
more detail and offer acceptable solutions for plated components and area array
packages. More plating solutions are acceptable for HP’s consumer products than for
HP’s high reliability products. However, solutions recommended in HP’s position
statement are acceptable for all product classes. It should be noted that product
organizations have ultimate control over the acceptance of components and materials.
For more information on HP’s requirements and the progress toward lead elimination in
electronics, please contact your HP procurement representative.
HP希望其供應商選擇HP授權之無鉛方案來實行無鉛策略轉換以滿足迫近的歐洲立法. 電鍍建義方法可參照 Appendix A “HP’s position on tin-based plating for Pb-free components” (“HP無鉛零件錫類電鍍定義”)