TA的首页SMT的专业术语
我这里有一些关于SMT的专业术语，和大家分享。
SMT :surface mount technology 表面黏着技术 AI :Auto-Insertion 自动插件
AQL :acceptable quality level 允收水平
ATE :automatic test equipment 自动测试
ATM :atmosphere 气压BGA :ball grid array 球形矩阵
CCD :charge coupled device 监视连接组件(摄影机)
CLCC :Ceramic leadless chip carrier 陶瓷引脚载具
COB :chip-on-board 芯片直接贴附在电路板上
cps :centipoises(黏度单位) 百分之一
CSB :chip scale ball grid array 芯片尺寸BGA CSP :chip scale package 芯片尺寸构装 CTE :coefficient of thermal expansion 热膨胀系数 DIP :dual in-line package 双内线包装(泛指手插组件)
FPT :fine pitch technology 微间距技术
FR-4 :flame-retardant substrate 玻璃纤维胶片(用?硌u作PCB材质)
IC :integrate circuit 集成电路 ?
IR :infra-red 红外线
Kpa :kilopascals(压力单位) LCC :leadless chip carrier 引脚式芯片承载器 MCM :multi-chip module 多层芯片模块 MELF :metal electrode face 二极管 MQFP :metalized QFP 金属四方扁平封装NEPCON :National Electronic Package and Production Conference 国际电子包装及生产会议 PBGA lastic ball grid array 塑料球形矩阵PCB rinted circuit board 印刷电路板PLCC lastic leadless chip carrier 塑料式有引脚芯片承载器ppm arts per million 指每百万PAD(点)有多少个不良PAD(点) psi ounds/inch2 磅/英吋PWB rinted wiring board 电路板QFP :quad flat package 四边平坦封装SIP :single in-line package SIR :surface insulation resistance 绝缘阻抗SMC :Surface Mount Component 表面黏着组件 SMD :Surface Mount Device 表面黏着组件SMEMA :Surface Mount Equipment Manufacturers Association 表面黏着设备制造协会SMT :surface mount technology 表面黏着技术SOIC :small outline integrated circuit SOJ :small out-line j-leaded package SOP :small out-line package 小外型封装SOT :small outline transistor 晶体管 SPC :statistical process control 统计过程控制SSOP :shrink small outline package 收缩型小外形封装TAB :tape automaticed bonding 带状自动结合TCE :thermal coefficient of expansion 膨胀(因热)系数Tg :glass transition temperature 玻璃转换温度THD :Through hole device 须穿过洞之组件(贯穿孔) TQFP :tape quad flat package 带状四方平坦封装UV :ultraviolet 紫外线uBGA :micro BGA 微小球型矩阵 ?cBGA :ceramic BGA 陶瓷球型矩阵PTH :Plated Thru Hole 导通孔 MESH 网目OXIDE 氧化物FLUX 助焊剂LGA (Land Grid Arry)封装技术LGA封装不需植球，适合轻薄短小产品应用。 ACF Anisotropic Conductive Film方性导电胶膜制程Solder mask 防焊漆Soldering Iron 烙铁 Solder balls 锡球 Solder Splash 锡渣 Solder Skips 漏焊 Through hole 贯穿孔Touch up 补焊Briding 穚接(短路) Solder Wires 焊锡线Solder Bars 锡棒Green Strength 未固化Transter Pressure 转印压力(印刷) Screen Printing 刮刀式印刷Solder Powder 锡颗粒Viscosity 黏度Solderability 焊锡性Applicability 使用性Flip chip 覆晶Depaneling Machine 组装电路板切割机Solder Recovery System 锡料回收再使用系统Wire Welder 主机板补线机X-Ray Multi-layer Inspection System X-Ray孔偏检查机BGA Open/Short X-Ray Inspection Machine BGA X-Ray检测机Prepreg Copper Foil Sheeter P.P. 铜箔裁切机Flex Circuit Connections 软性排线焊接机 ­ LCD Rework Station 液晶显示器修护机Battery Electro Welder 电池电极焊接机PCMCIA Card Welder PCMCIA卡连接器焊接 A Laser Diode 半导体雷射Ion Lasers 离子雷射Nd: YAG Laser 石榴石雷射 DPSS Lasers 半导体激发固态雷射Ultrafast Laser System 超快雷射系统MLCC Equipment 积层组件生产设备 Green Tape Caster, Coater 薄带成型机ISO Static Laminator 积层组件均压机Green Tape Cutter 组件切割机Chip Terminator 积层组件端银机MLCC Tester 积层电容测试机Components Vision Inspection System芯1片组件外观检查机 电容漏电流寿命测试机 Capacitor Life Test with Leakage Current 芯片打带包装机 Taping Machine 组件表面黏着设备 Surface Mounting Equipment 电阻银电极沾附机 Silver Electrode Coating Machine TFT-LCD(薄膜晶体管液晶显示器) 笔记型用STN-LCD(中小尺寸超扭转向液晶显示器 行动电话用PDA(个人数字助理器) CMP(化学机械研磨)制程研磨液(Slurry) Compact Flash Memory Card (简称CF记忆卡) MP3、PDA、数位相机Dataplay Disk(微光盘)。交换式电源供应器(SPS) 专业电子制造服务 (EMS) 高密度连结板（HDI board， 指线宽／线距小于4／
SMT :surface mount technology 表面黏着技术 AI :Auto-Insertion 自动插件
AQL :acceptable quality level 允收水平
ATE :automatic test equipment 自动测试
ATM :atmosphere 气压BGA :ball grid array 球形矩阵
CCD :charge coupled device 监视连接组件(摄影机)
CLCC :Ceramic leadless chip carrier 陶瓷引脚载具
COB :chip-on-board 芯片直接贴附在电路板上
cps :centipoises(黏度单位) 百分之一
CSB :chip scale ball grid array 芯片尺寸BGA CSP :chip scale package 芯片尺寸构装 CTE :coefficient of thermal expansion 热膨胀系数 DIP :dual in-line package 双内线包装(泛指手插组件)
FPT :fine pitch technology 微间距技术
FR-4 :flame-retardant substrate 玻璃纤维胶片(用?硌u作PCB材质)
IC :integrate circuit 集成电路 ?
IR :infra-red 红外线
Kpa :kilopascals(压力单位) LCC :leadless chip carrier 引脚式芯片承载器 MCM :multi-chip module 多层芯片模块 MELF :metal electrode face 二极管 MQFP :metalized QFP 金属四方扁平封装NEPCON :National Electronic Package and Production Conference 国际电子包装及生产会议 PBGA lastic ball grid array 塑料球形矩阵PCB rinted circuit board 印刷电路板PLCC lastic leadless chip carrier 塑料式有引脚芯片承载器ppm arts per million 指每百万PAD(点)有多少个不良PAD(点) psi ounds/inch2 磅/英吋PWB rinted wiring board 电路板QFP :quad flat package 四边平坦封装SIP :single in-line package SIR :surface insulation resistance 绝缘阻抗SMC :Surface Mount Component 表面黏着组件 SMD :Surface Mount Device 表面黏着组件SMEMA :Surface Mount Equipment Manufacturers Association 表面黏着设备制造协会SMT :surface mount technology 表面黏着技术SOIC :small outline integrated circuit SOJ :small out-line j-leaded package SOP :small out-line package 小外型封装SOT :small outline transistor 晶体管 SPC :statistical process control 统计过程控制SSOP :shrink small outline package 收缩型小外形封装TAB :tape automaticed bonding 带状自动结合TCE :thermal coefficient of expansion 膨胀(因热)系数Tg :glass transition temperature 玻璃转换温度THD :Through hole device 须穿过洞之组件(贯穿孔) TQFP :tape quad flat package 带状四方平坦封装UV :ultraviolet 紫外线uBGA :micro BGA 微小球型矩阵 ?cBGA :ceramic BGA 陶瓷球型矩阵PTH :Plated Thru Hole 导通孔 MESH 网目OXIDE 氧化物FLUX 助焊剂LGA (Land Grid Arry)封装技术LGA封装不需植球，适合轻薄短小产品应用。 ACF Anisotropic Conductive Film方性导电胶膜制程Solder mask 防焊漆Soldering Iron 烙铁 Solder balls 锡球 Solder Splash 锡渣 Solder Skips 漏焊 Through hole 贯穿孔Touch up 补焊Briding 穚接(短路) Solder Wires 焊锡线Solder Bars 锡棒Green Strength 未固化Transter Pressure 转印压力(印刷) Screen Printing 刮刀式印刷Solder Powder 锡颗粒Viscosity 黏度Solderability 焊锡性Applicability 使用性Flip chip 覆晶Depaneling Machine 组装电路板切割机Solder Recovery System 锡料回收再使用系统Wire Welder 主机板补线机X-Ray Multi-layer Inspection System X-Ray孔偏检查机BGA Open/Short X-Ray Inspection Machine BGA X-Ray检测机Prepreg Copper Foil Sheeter P.P. 铜箔裁切机Flex Circuit Connections 软性排线焊接机 ­ LCD Rework Station 液晶显示器修护机Battery Electro Welder 电池电极焊接机PCMCIA Card Welder PCMCIA卡连接器焊接 A Laser Diode 半导体雷射Ion Lasers 离子雷射Nd: YAG Laser 石榴石雷射 DPSS Lasers 半导体激发固态雷射Ultrafast Laser System 超快雷射系统MLCC Equipment 积层组件生产设备 Green Tape Caster, Coater 薄带成型机ISO Static Laminator 积层组件均压机Green Tape Cutter 组件切割机Chip Terminator 积层组件端银机MLCC Tester 积层电容测试机Components Vision Inspection System芯1片组件外观检查机 电容漏电流寿命测试机 Capacitor Life Test with Leakage Current 芯片打带包装机 Taping Machine 组件表面黏着设备 Surface Mounting Equipment 电阻银电极沾附机 Silver Electrode Coating Machine TFT-LCD(薄膜晶体管液晶显示器) 笔记型用STN-LCD(中小尺寸超扭转向液晶显示器 行动电话用PDA(个人数字助理器) CMP(化学机械研磨)制程研磨液(Slurry) Compact Flash Memory Card (简称CF记忆卡) MP3、PDA、数位相机Dataplay Disk(微光盘)。交换式电源供应器(SPS) 专业电子制造服务 (EMS) 高密度连结板（HDI board， 指线宽／线距小于4／
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