最新欧盟官方认可的ROHS指令豁免清单一览表（2008-7-11）

（依据2002/95/EC及2005/717/EC、2005/747/EC、2006/310/EC、2006/690/EC、
2006/691/EC、2006/692/EC & 2008/385/EC 7次修改） - 2008.07




豁 免 项

对应文件号
签署/颁布日期

1. Mercury in compact fluorescent lamps not exceeding 5 mg / lamp

小型日光灯中的汞含量不得超过5毫克/灯

2002/95/EC
2003.01.27/
2003.02.13


2a. Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10 mg
一般用途的直管日光灯中的汞含量不得超过磷酸盐10 毫克


2b. Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate 5 mg.
一般用途的直管日光灯中的汞含量不得超过正常的三磷酸盐 5毫克


2c. Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate 8 mg
一般用途的直管日光灯中的汞含量不得超过长效的三磷酸盐 8毫克

1. Mercury in straight fluorescent lamps for special purposes.

特殊用途的直管日光灯中的汞含量

1. Mercury in other lamps not specifically mentioned in this list

本附录中未特别提及的其它照明灯中的汞含量

1. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes

阴极射线管、电子部件和荧光管的玻璃内的铅含量


6a. Lead as an alloying element in steel containing up to 0.35% lead by weight.
铅作为钢的合金元素，其含量可达0.35%（重量计）


6b. Lead as an alloying element in aluminum containing up to 0.4% lead by weight.
铅作为铝的合金元素，其含量可达0.4%（重量计）


6c. Lead as an alloying element in copper containing up to 4% lead by weight
铅作为铜的合金元素，其元素含量可达4%（重量计）


7a. Lead in high melting temperature type solders. (i.e. lead based solder alloys containing 85% by weight or more lead)
较高熔融温度型焊料中的铅（即：铅含量达85%或以上的铅基焊料合金）

2005/747/EC
2005.10.21/
2005.10.25


7b. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications.
用于服务器、存储和存储列阵系统、以及电信用交换、发信、传输和网络管理的网络基础设施设备的焊料中的铅


7c. Lead in electronic ceramic parts (e.g. piezoelectronic devices.)
电子陶瓷产品中的铅（例如：高压电子装置）

1. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations

除了76/769/EEC《关于限制某些有害物质和制品销售和使用》指令的修改件91/338/EEC 指令中禁止用途外，电触头和镉镀层上的镉及其化合物

1. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators

吸收式电冰箱中作为碳钢冷却系统防腐层用的六价铬

2002/95/EC
2003.01.27/
2003.02.13


9 a. DecaBDE in polymeric applications
聚合物中用的十溴二苯醚 ------据欧洲法院判决该条于2008.07.01删除，不被豁免

2005/717/EC
2005.10.13/
2005.10.15


9 b. lead in lead-bronze bearing shells and bushes
铅黄铜轴承壳和电刷中的铅

1. Within the procedure referred to in Article 7(2), the Commission shall evaluate the applications for:

— Deca BDE,
— mercury in straight fluorescent lamps for special purposes,
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications (with a view to setting a specific time limit for this exemption), and
－ light bulbs,
欧盟委员会应根据在第7（2）条中提及的程序，评价以下方面的应用： － 十溴二苯醚； － 特殊用途的直管日光灯中的汞； － 以下用途中所使用的焊料中的铅：服务器、存储器、用于交换和传输的网络基础设施、电信网络管理设备（旨在设定本指令豁免部分的特定截止时间）； － 灯泡。

2002/95/EC
2003.01.27/
2003.02.13

1. Lead used in compliant pin connector systems

自适应插脚系统中的铅

2005/747/EC
2005.10.21/
2005.10.25

1. Lead as a coating material for a thermal conduction module c-ring

作为热导模块C环镀层材料的铅


13a. Lead in optical and filter glass
光学滤光玻璃中的铅


13b. Cadmium in optical and filter glass
光学滤光玻璃中的镉

1. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight

连接插脚与微处理器封装、含两个元素以上且铅含量大于80％而小于85％的焊料中的铅

1. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages

集成电路倒装晶片封装的半导体连接片和托架之间实施电气连接用焊料中的铅

1. Lead in linear incandescent lamps with silicate coated tubes.

管状白炽灯硅酸盐涂层灯管中的铅

2006/310/EC
2006.04.21/
2006.04.28

1. Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications.

专业复印设备用的高强度放电(HID)灯中作为发光剂的卤化铅

1. Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb).

当放电灯被用作含磷仿日晒灯(sun tanning lamps)，比如BSP (BaSi2O5:Pb)，或重氮复印、平版印刷、捕虫器、以及含磷光化学和含磷食物加工过程的专业灯时，比如SMS ((Sr,Ba)2MgSi2O7:Pb)，放电灯中的荧光粉触媒剂的铅(铅含量1％或以下)

1. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL).

紧凑型节能灯(ESL)中作为主要汞合金的特定成分中PbBiSn-Hg和PbinSg-Hg中的铅以及作为辅助汞合金中PbSn-Hg中的铅

2006/310/EC
2006.04.21/
2006.04.28

1. Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD).

液晶显示器(LCD)用连接荧光灯前后基片用玻璃中的氧化铅

2006/310/EC
2006.04.21/
2006.04.28

1. Lead and cadmium in printing inks for the application of enamels on borosilicate glass.

用于硼硅酸盐玻璃瓷漆的印墨所含的铅及镉

2006/691/EC
2006.10.12/
2006.10.14

1. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems.

于光纤通讯系统稀土铁石榴石法拉第旋转器中作为杂质的铅

1. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames.

小间距零部件面料所含的铅

1. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅

1. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.

等离子显示屏(PDP)及表面传导式电子发射显示器(SED)的构件所用的氧化铅

1. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.

蓝黑灯管(BLB)玻璃外罩所含的氧化铅

1. Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.

在大功率扬声器中作为转换器焊料的铅合金

1. Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasteners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July 2007.’

金属板防腐蚀涂层防腐蚀牢固剂及第2002/96/EC号指令中第三类设备的电磁干扰屏障所含的六价铬。这项豁免有效期至2007年7月1日

2006/692/EC
2006.10.12/
2006.10.14

1. Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC (*).

理事会第69/493/EEC号指令附件 1( 第 一、二、三 及 四 类 ) 所指水晶玻璃含有的铅

2006/690/EC
2006.10.12/
2006.10.14

1. Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more.

直接位于声压级大于或等于100分貝高功率音箱中音圈转换器上的电导体的電气或机械焊点中的鎘合金。

2008/385/EC
2008.01.24/
2008.05.24

1. Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting).

无汞平面荧光灯(用于液晶显示器、設計或工业照明设备)中焊料中所含的鉛。

2008/385/EC
2008.01.24/
2008.05.24

1. Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes.

封裝氬和氪激光管防护窗组件封装玻壳所含鉛氧化物。

2008/385/EC
2008.01.24/
2008.05.24