On Solder Paste Measurement System
Equipment Engineering group will make a MSA study on current Solder paste Measurement system which will be used to collect key process parameter-Solder paste height and put into Auto SPC alarm later.
SPC Chart of Solder paste height was dotted and controlled by manually, now Quality group contact IT to develop software to automatic dot SPC chart and alarm .
MSA Process and Sample Plan
Before measurement, Equipment Engineer(Shw) use measurement machine operation to give 3 EE technicians training to make sure all measurement process in consistence.
10 Printing samples from current build line 7 of Modelare selected for study.(to reduce the time and environment factor impact on solder paste height, The 10 samples took from line7 as twice , each get 5 samples.)
PQA send the samples in random order to the first ope. to measure once to get blind sampling data according SOP, Location at U8
Have the 2nd and then the 3rd operators measure all the samples once in random order.
Repeat the last 2 steps and have 3 trials to get 3 reading for each PCB
Model Observed Response = Operator + Part + Operator*Part + Response(error)
The measurement result are shown below:
Measurement characteristic: Solder Paste Height
Tolerance: 4-8 mil (1mil=25.4/1000 mm)
ophylia (威望:0) (广东 广州) 在校学生 经理 - 习百家真言，悟变化之道