FPC 柔性印刷线路板 Flexible Printed Circuit
FCCL 柔性覆铜箔 Flexible copper clad laminate
PI 聚酰亚胺膜 Polyimide Film
基材 base material
钻孔 drilling
通孔 through hole
通孔 via
黑孔 black hole
盖膜 Cover-lay
补强板 stiffener
绝缘层 Insulator
接着剂 ADH
辊压铜箔 rolled copper foil
电解铜箔 electrolytic foil
导通的 conductive
碳粒子 carbon particles
负电的 negative electric charge
循环水洗 cascade Rinse
双边传动 double－side transmission
D/F压膜 D/F film-laminated
感光干膜 sensitive dry film
曝光 exposure
平行光 parallel light
离散光 discrete light
显影 developing
碳酸钠溶液 sodium carbonate solution.
温度 temperature   
速度 speed
浓度 concentration
喷淋压力 spouting pressure
压强 pressure
蚀刻 etching
剥膜 stripping
盐酸 hydrochloric acid
过氧化氢 hydrogen peroxide solution
温度 temperature
阻焊 solder resist

FPC 柔性印刷线路板 Flexible Printed Circuit
FCCL 柔性覆铜箔 Flexible copper clad laminate
PI 聚酰亚胺膜 Polyimide Film
基材 base material
钻孔 drilling
通孔 through hole
通孔 via
黑孔 black hole
盖膜 Cover-lay
补强板 stiffener
绝缘层 Insulator
接着剂 ADH
辊压铜箔 rolled copper foil
电解铜箔 electrolytic foil
导通的 conductive
碳粒子 carbon particles
负电的 negative electric charge
循环水洗 cascade Rinse
双边传动 double－side transmission
D/F压膜 D/F film-laminated
感光干膜 sensitive dry film
曝光 exposure
平行光 parallel light
离散光 discrete light
显影 developing
碳酸钠溶液 sodium carbonate solution.
温度 temperature   
速度 speed
浓度 concentration
喷淋压力 spouting pressure
压强 pressure
蚀刻 etching
剥膜 stripping
盐酸 hydrochloric acid
过氧化氢 hydrogen peroxide solution
温度 temperature
阻焊 solder resist